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Friday | 1:30 – 5:30 PM

August 11, 2017

This tutorial will lead the audience through the proper process to use when characterizing a high-speed interconnect at frequencies up to 50 GHz. This characterization methodology is being captured in the IEEE P370 standards development project, and members of the P370 working group will be explaining how one would apply the future standard to a “real-world” characterization study. The discussion will cover details of how to meet the electrical requirements of a proper test fixture, how to verify that your de-embedding tool correctly subtracted the fixture’s contribution from the overall measured response, and how to verify the integrity of the measured, de-embedded S-parameters before using them in end-to-end link models.

Chair:
Heidi Barnes, Keysight Technologies, Santa Rosa, California, USA
Co-Chair:
Mikheil Tsiklauri, Missouri University of Science & Technology, Rolla, Missouri, USA;
Samuel Connor, IBM Corporation, Research Triangle Park, NC, USA

Speakers and Topics:

1:30 pm – 1:45 pm ET
Electrical Characterization of a High-Speed Interconnect using the IEEE P370 Standard – Brief Overview of the Purpose and Scope of P370
Samuel Connor, IBM Corporation, Raleigh, North Carolina, USA; Xiaoning Ye, Intel Corporation, Hillsboro, Oregon, USA

1:45 pm – 2:25 pm ET
Design Considerations and Acceptance Criteria for Test Fixtures
Heidi Barnes, Keysight Technologies, Santa Rosa, California, USA

2:25 pm – 3:00 pm ET
Verification of a De-embedding Algorithm and Process, and Some Consistency Tests
Eric Bogatin, Teledyne LeCroy, Longmont, Colorado, USA

3:30 pm – 4:10 pm ET
S-Parameters Integrity and Validation
Mikheil Tsiklauri and Jun Fan, Missouri University of Science & Technology, Rolla, Missouri, USA

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